MWALIKO
PACK EXPO INTERNATIONAL 2018
Techik Instrument (Shanghai) Co., Ltd itahudhuria PACK EXPO INTERNATIONAL 2018, Oktoba 14-17, Chicago, IL USA.
Tunatazamia ziara yako na ujaribu mashine ana kwa ana.
Kuridhika kwako ndio jambo letu kuu.
Techik Booth No.:E-9423
Tarehe:14-17 Oktoba 2018
MCCORMICK PLACE ,CHICAGO, IL USA
Muda wa kutuma: Sep-26-2018