MWALIKO

PACK EXPO INTERNATIONAL 2018

Techik Instrument (Shanghai) Co., Ltd itahudhuria PACK EXPO INTERNATIONAL 2018, Oktoba 14-17, Chicago, IL USA.

Tunatazamia ziara yako na ujaribu mashine kibinafsi.

Kuridhika kwako ndio jambo letu kuu.

Techik Booth No.:E-9423

Tarehe:14-17 Oktoba 2018

MCCORMICK PLACE ,CHICAGO, IL USA