INVITATION

PACK EXPO INTERNATIONAL 2018

Techik Instrument (Shanghai) Co., Ltd will attend the PACK EXPO INTERNATIONAL 2018, Oct. 14-17, Chicago, IL USA.

We are looking forward to your visit and test the machine in person.

Your satisfaction is our top concern.

Techik Booth No.:E-9423

Date:14-17 October 2018

MCCORMICK PLACE ,CHICAGO, IL USA