fanasana
PACK EXPO INTERNATIONAL 2018
Techik Instrument (Shanghai) Co., Ltd dia hanatrika ny PACK EXPO INTERNATIONAL 2018, Oktobra 14-17, Chicago, IL Etazonia.
Miandrandra ny fitsidihanao sy hizaha toetra manokana ny milina izahay.
Ny fahafaham-ponao no tena mampanahy anay.
Techik Booth No.:E-9423
Daty: 14-17 Oktobra 2018
MCCORMICK PLACE, CHICAGO, IL USA
Fotoana fandefasana: Sep-26-2018