GAYYATA
PACK EXPO INTERNATIONAL 2018
Techik Instrument (Shanghai) Co., Ltd zai halarci PACK EXPO INTERNATIONAL 2018, Oktoba 14-17, Chicago, IL USA.
Muna ɗokin ziyarar ku da gwada na'urar a cikin mutum.
Gamsar da ku ita ce babbar damuwarmu.
Techik Booth Lamba: E-9423
Kwanan wata: 14-17 Oktoba 2018
MCCORMICK PLACE, CHICAGO, IL USA
Lokacin aikawa: Satumba-26-2018