Pack Expo International 2018

GAYYATA

PACK EXPO INTERNATIONAL 2018

Techik Instrument (Shanghai) Co., Ltd zai halarci PACK EXPO INTERNATIONAL 2018, Oktoba 14-17, Chicago, IL USA.

Muna ɗokin ziyarar ku da gwada na'urar a cikin mutum.

Gamsar da ku ita ce babbar damuwarmu.

Techik Booth Lamba: E-9423

Kwanan wata: 14-17 Oktoba 2018

MCCORMICK PLACE, CHICAGO, IL USA


Lokacin aikawa: Satumba-26-2018

Aiko mana da sakon ku:

Ku rubuta sakonku anan ku aiko mana